Integrated Circuits (ICs)
Microprocessors, Microcontrollers, ASICs, FPGAs, SoCs
Combination of ultra-thin high-density silicon capacitors and power supply network (BSPDN) on the ba
| Available For: Taiwan | Semiconductors and Electronics |
This invention combines Ultra-Thin High-Density Silicon Capacitors (UTHDSC) with a Backside Power Supply Network (BSPDN) specifically for the 2nm semiconductor node. It addresses power stability and...
| Application Number | M668047 |
| Patent Number | TWM668047U |
| Current Status | Issued |
Combination of Ultra-Thin High-Density Silicon Capacitors and Fan-out Packaging Glass Substrate
| Available For: Taiwan | Semiconductors and Electronics |
This innovation combines Ultra-Thin High-Density Silicon Capacitors (UTHDSCs) with fan-out packaging glass substrates to enhance electrical performance. By embedding UTHDSCs within or near the...
| Application Number | M669584 |
| Patent Number | TWM669584U |
| Current Status | Issued |